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The FAS Technologies coating systems process current and future generation substrates for the flat panel display, multi-chip module, solar cell, biomedical, and semiconductor industries. The FAS products  have proven performance and efficiency for both pilot and production fabrication facilities.  Please refer to the links on the navigation bar on the left for information on some of FAS' products. 
      

FAS' products use the FAS-Coat™, FAS' proven, proprietary technology for the flat panel display industry.  For more information about FAS-Coat™, please refer to the Technology section of this site or click on the link below. 

Efficient application of liquid polymer films is a key element to reduce costs and boost productivity in an increasingly competitive market for the manufacturers of flat panel displays and other large area microelectronics. Liquid extrusion coating, also referred to as spinless coating, significantly improves material utilization compared to more traditional techniques, such as spin- and roller-coating, leading to improved performance and a lower cost of ownership.

FAS Technologies, with its patented FAS-Coat extrusion coating equipment, is the market leader in extrusion coating systems for flat panel display and semiconductor applications. FAS and its equipment integrators have an installed base of over 200 production systems, using both extrusion and extrude & spin processing. FAS’ experience in these systems has led to the further development and introduction of the Advantage Series coaters, which are now available for a wide range of substrate sizes.

FAS' Advantage Series Coater allow for some of the following advantages:

o Maximized polymer utilization
o A broad range of coating thicknesses (generally from as low as 100 nanometers to greater than  
   100 microns, depending on the process chemistry)
o The ability to coat very thick layers in a single pass
o Excellent coverage over varying surface topography
o Ability to coat without the mechanical stress of spin coating
o Potential reduction in overall film stresses
o Minimized system footprint
o Economical use of solvents
o Greatly reduced environmental impact
o A practical selection of standard options
o Customization to meet specific customer requirements
o Suitable for both R&D and production applications 

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