Spin-coating has been the traditional technology used by microelectronic manufacturers in applying multiple-viscosity process fluids to wafers and other substrates. FAS’ patented FAS-Coat™ coating technology offers several advantages over these traditional spin-coating systems. Spin-coating uses a method whereby substrates are spun at extremely high speeds while fluid is poured onto the center, using centrifugal force to cover the substrate. A great deal of fluid (up to 98%) is forced off the surface.
 

FAS’ extrusion products, however, deposit the fluid with precise uniformity over the surface of the substrate with almost no waste of material. Additionally, the microelectronics industry is being driven toward more complex products requiring larger area substrates, as evidenced by the mass production of high definition television (HDTV) screens and larger flat panel displays. When coating at these increased resolutions and larger sizes, spinning techniques pose significant technological limitations, including higher susceptibility to damage, which FAS’ pure extrusion coating systems overcome.
 

The microelectronics industry is also using larger wafers (beyond 200mm) in order to lower costs and increase manufacturing capacity. The cost of multiple-viscosity process materials and the high volume of those materials that are lost by the current generation of spin-coating technology are also placing severe pressure on manufacturers who are seeking to lower costs. FAS’ extrusion products resolve both of these issues. With its patented FAS-Coat™ technology, FAS is well positioned to lead the shift away from traditional spin-coating to extrusion technology.

FAS-Coat™ systems use a patented extrusion process to apply a variety of multiple-viscosity fluids with microscopic precision across larger areas and with substantially less waste than do the current generation of spin-coating systems used in comparable applications. Materials processed by FAS-Coat™ systems include photoresist, polyimide, color filter materials, phosphors, emulsions and similar materials. FAS-Coat™ systems offer many advantages over competing spin-coating systems as they:

(i) Enable precision application of multiple-viscosity fluids to larger substrates,
(ii) Allow smaller microelectronic feature definition,
(iii) Produce higher yields,
(iv) Lower material costs,
(v) Increase rates of throughput and
(vi) Reduce manufacturing-line footprint requirements.

The effective combination of greater precision, higher throughput, adaptability to large substrates and significantly reduced waste of coating materials is the foundation of FAS’ technology advantage and market strategy.

Process fluids used in microelectronics manufacturing are generally considered to be hazardous materials subject to environmental regulation in most modern economies. The microelectronics industry is seeking to be environmentally conscientious. Industry participants are implementing programs aimed at preventing pollution, minimizing waste, conserving natural resources and recycling water, chemicals and packaging materials. Research programs are underway with the ultimate goal of making microelectronic manufacturing an environmentally benign process. As environmental controls are tightened across the world, these manufacturers are forced to adopt expensive measures to dispose of the 95% of process fluids wasted with traditional spin-coating. These manufacturers can directly benefit from FAS-Coat™ extrusion technology since little or no material is wasted.

FAS believes that a number of key trends that are fueling the new industry growth will demand the advantages of FAS-Coat™ systems. In order to increase throughput and decrease cost to meet growing demand for flat panel display desktop monitors, manufacturers are moving to larger substrates to get more and larger displays per process run. There are serious limitations to spinning such large substrates that FAS-Coat™ technology fully overcomes.